When Architect meets Innovations…

ActivSkeen will be present on 27 and 28 September 2018 at the Architect@Work* 2018 trade fair at the Paris Event Center in Porte de la Villette. On our stand n°191, we will be pleased to present the latest developments in terms of active materials dedicated to the building envelope, including a photovoltaic solution which, in addition to being perfectly integrated architecturally, makes it possible to cover all of the building’s electrical needs.

Do not hesitate to contact us if you would like to take advantage of a free invitation to come and meet us.

We look forward to welcoming you on our stand n°191.

Partager ce contenu !