ActivSkeen, sponsor of the 13th edition of Advanced Building Skins

As a new player in active building envelopes, ActivSkeen is sponsoring the 13th edition of Advanced Building Skins, which will be held in Bern (Switzerland) on 1 and 2 October.

This event is the ideal place to keep abreast of technical and technological advances in terms of high added value envelopes. We will also be there to exchange with researchers, industrialists, façade designers and architects and show them how active envelopes can be real architectural and functional opportunities.

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