ActivSkeen, sponsor of the 13th Conference on Advanced Building Skins

Monday, October 1, 2018

First European event for ActivSkeen

As a new member of the active envelope community, ActivSkeen has sponsored the 13th Conference on Advanced Building Skins, which takes place in Bern, Switzerland, 1-2 October 2018.

This event is the right place to get information about the last technical and technological developments on Advanced building skins. We will attend this conference to meet and exchange with scientists, façades specialists, industrials but also with architects to show them how active envelopes can be real design and functional opportunities.

Want to explore the possibilities?

Contact us